A Solution Processable High-Performance Thermoelectric Copper Selenide Thin Film

Authors

Courtney Hollar, Boise State University
Yanliang Zhang, Boise State University

Document Type

Article

Publication Date

6-6-2017

Abstract

A solid‐state thermoelectric device is attractive for diverse technological areas such as cooling, power generation and waste heat recovery with unique advantages of quiet operation, zero hazardous emissions, and long lifetime. With the rapid growth of flexible electronics and miniature sensors, the low‐cost flexible thermoelectric energy harvester is highly desired as a potential power supply. Herein, a flexible thermoelectric copper selenide (Cu₂Se) thin film, consisting of earth‐abundant elements, is reported. The thin film is fabricated by a low‐cost and scalable spin coating process using ink solution with a truly soluble precursor. The Cu₂Se thin film exhibits a power factor of 0.62 mW/(m K²) at 684 K on rigid Al₂O₃ substrate and 0.46 mW/(m K²) at 664 K on flexible polyimide substrate, which is much higher than the values obtained from other solution processed Cu₂Se thin films (<0.1mW/(m K²)) and among the highest values reported in all flexible thermoelectric films to date (≈0.5 mW/(m K²)). Additionally, the fabricated thin film shows great promise to be integrated with the flexible electronic devices, with negligible performance change after 1000 bending cycles. Together, the study demonstrates a low‐cost and scalable pathway to high‐performance flexible thin film thermoelectric devices from relatively earth‐abundant elements.

Comments

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Publication Information

Hollar, Courtney and Zhang, Yanliang. (2017). "A Solution Processable High-Performance Thermoelectric Copper Selenide Thin Film". Advanced Materials, 29(21), 1606662-1 - 1606662-6. http://dx.doi.org/10.1002/adma.201606662