Creating a Microplasma Discharge Using an RF Generated Plasma Source

Authors

Eric Wright, Department of Electrical and Computer Engineering, Boise State UniversityFollow
Janos Cserna, Department of Electrical and Computer Engineering, Boise State UniversityFollow
Rashana Acharya, Department of Electrical and Computer Engineering, Boise State UniversityFollow
Wes Butler, Department of Electrical and Computer Engineering, Boise State UniversityFollow
Brian McMillon, Department of Electrical and Computer Engineering, Boise State UniversityFollow
Brooke Garner, Department of Electrical and Computer Engineering, Boise State UniversityFollow
David Mullner, Department of Electrical and Computer Engineering, Boise State UniversityFollow

Document Type

Student Presentation

Presentation Date

4-15-2013

Faculty Sponsor

Jim Browning

Abstract

A device is needed that will withstand harsh environments because normal semiconductors are incapable of functioning at high temperatures (> 150 C) and in high radiation environment. Microplasma based devices are being developed for this purpose. The device consists of a slit structure in a dielectric material. The slits range in size from 0.3 to 1.2 mm. Device fabrication includes Low Temperature Co-fired Ceramic (LTCC), which contains an Radio-Frequency (RF) antenna and three DC terminals. The RF antenna operates from 800 to 1000 MHz. The DC terminals serve the same purpose as in a normal transistor. Results of the experimental measurements of the device Current-Voltage characteristics will be presented for a range of gas pressures, RF powers, and slit dimensions.