Title
Thermal Environment Control of a Memory Module Tester
Document Type
Presentation
Publication Date
4-12-2010
Faculty Sponsor
Dr. James Ferguson
Abstract
The purpose of our research is to control the temperature of computer memory chip modules during testing. Our poster will convey our heat transfer calculations, our design, prototype and testing procedures. The poster will ultimately show how we used mechanical engineering techniques to solve the problem of controlling the temperature of the computer memory chips as they are undergoing testing.
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