Summary & Purpose

These files are transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) images from a single TEM lamellae. Images are collected using FEI Tecnai TF30-FEG STEM at a variety of magnifications to enable characterization of various features including grains/laths, carbide precipitates, dislocation lines, nanoscale phases, dislocation loops (if present), and voids (if present).

Date of Publication or Submission

2017

DOI

http://dx.doi.org/10.18122/B2P30V

Funding Citation

This research was sponsored in part by the US Nuclear Regulatory Commission Grant NRC-HQ-84-14-G-0056, the Micron Foundation, and by the US DOE, Office of Nuclear Energy under DOE Idaho Operations Office Contract DE-AC07-05ID14517, as part of the Nuclear Science User Facilities experiments 13-419, 14-486, 15-540, 15-569, 16-625, and 16-710.

Single Dataset or Series?

Series

Data Format

TEM image format is .dm3 These files may be viewed in either Digital Micrograph or ImageJ. In these software packages, scaling information is retained. Files may be converted to different format (e.g. .jpeg), but scaling information is thus lost. STEM image format is .tif These files may be viewed in any photo or image viewer.

Data Attributes

Irradiation conducted at Michigan Ion Beam Laboratory (MIBL). Dose rate = 2.23 x 10^(-4) dpa/s. TEM lamellae were prepared using an FEI Quanta 3D FEG focused ion beam (FIB) at the Center for Advanced Energy Studies (CAES). TEM lamellae were cut and lifted perpendicular to the surface of the bulk. This orientation provided a cross-section of the damage profile through the depth of the TEM film. Prior to milling, all specimen surfaces were protected with a 3 µm platinum deposit, which ensured that the original proton-irradiated surface was retained for reference. Each sample was milled at 30 kV to an estimated thickness of ~100 nm, width of ~15 µm, and depth of ~7 µm. The samples were subsequently milled at 5 kV to an estimated thickness of 50-100 nm, followed by cleaning at 2 kV for approximately 1 minute on each side. The purpose of the cleaning process was to reduce any surface damage to the sample caused by the milling. Dislocation loops were imaged in STEM mode in which small collection (ß) and convergence (a) angles are applied to create a STEM bright field image.

Time Period

TEM imaging conducted on 20151030.

Privacy and Confidentiality Statement

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Use Restrictions

Users are free to share, copy, distribute and use the dataset; to create or produce works from the dataset; to adapt, modify, transform and build upon the dataset as long as the user attributes any public use of the dataset, or works produced from the dataset, referencing the author(s) and DOI link. For any use or redistribution of the dataset, or works produced from it, the user must make clear to others the license of the dataset and keep intact any notices on the original dataset. If users publicly use any adapted version of this dataset, or works produced from an adapted dataset, you must also offer that adapted database under this license. If users redistribute the dataset, or an adapted version of it, then users may use technological measures that restrict the work (such as DRM) as long as users also redistribute a version without such measures. This dataset may not be used for commercial purposes.

Disclaimer of Warranty

BOISE STATE UNIVERSITY MAKES NO REPRESENTATIONS ABOUT THE SUITABILITY OF THE INFORMATION CONTAINED IN OR PROVIDED AS PART OF THE SYSTEM FOR ANY PURPOSE. ALL SUCH INFORMATION IS PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND. BOISE STATE UNIVERSITY HEREBY DISCLAIMS ALL WARRANTIES AND CONDITIONS WITH REGARD TO THIS INFORMATION, INCLUDING ALL WARRANTIES AND CONDITIONS OF MERCHANTABILITY, WHETHER EXPRESS, IMPLIED OR STATUTORY, FITNESS FOR A PARTICULAR PURPOSE, TITLE AND NON-INFRINGEMENT. IN NO EVENT SHALL BOISE STATE UNIVERSITY BE LIABLE FOR ANY SPECIAL, INDIRECT OR CONSEQUENTIAL DAMAGES OR ANY DAMAGES WHATSOEVER RESULTING FROM LOSS OF USE, DATA OR PROFITS, WHETHER IN AN ACTION OF CONTRACT, NEGLIGENCE OR OTHER TORTIOUS ACTION, ARISING OUT OF OR IN CONNECTION WITH THE USE OR PERFORMANCE OF INFORMATION AVAILABLE FROM THE SYSTEM. THE INFORMATION PROVIDED BY THE SYSTEM COULD INCLUDE TECHNICAL INACCURACIES OR TYPOGRAPHICAL ERRORS. CHANGES ARE PERIODICALLY ADDED TO THE INFORMATION HEREIN. COMPANY AND/OR ITS RESPECTIVE SUPPLIERS MAY MAKE IMPROVEMENTS AND/OR CHANGES IN THE PRODUCT(S) AND/OR THE PROGRAM(S) DESCRIBED HEREIN AT ANY TIME, WITH OR WITHOUT NOTICE TO YOU. BOISE STATE UNIVERSITY DOES NOT MAKE ANY ASSURANCES WITH REGARD TO THE ACCURACY OF THE RESULTS OR OUTPUT THAT DERIVES FROM USE OF THE SYSTEM.

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