2026 Undergraduate Research Showcase

Lateral Field Emitter Jig and Electron Hop Funnel Fabrication Process

Document Type

Student Presentation

Presentation Date

4-24-2026

Faculty Sponsor

Dr. Jim Browning and Dr. Marcus Pearlman

Abstract

The Boise State CMEMs (Ceramic Micro Electrical Mechanical Systems) Lab integrates field emitter arrays (FEAs) into vacuum electron devices. Accomplished through funnels called electron hop funnels, electrons are emitted from the FEA into the wide end of the funnel and "hop" up the sloped walls. The electrons exit the narrow end of the funnel as a dense, uniform electron beam. These electrons sources have application in microwave vacuum electron devices and vacuum transistors. This poster demonstrates the fabrication process of a FEA jig and hop funnel structure, both constructed from the vacuum compatible material of low temperature co-fired ceramic (LTCC). This jig houses the lateral field emitter wafer, with various jumped connections applied that are necessary to operate the device. The hop funnel structure is made by milling through a thin layer of LTCC, using an angled bit. Finally, the hop funnel can be placed over the lateral field emitter wafer along with a few other components necessary for its operation.

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