Improving Electrical Connection through Silver Pasted Vias
Faculty Mentor Information
Dr. Marcus Pearlman, Boise State University; and Dr. Jim Browning, Boise State University
Presentation Date
7-16-2026
Abstract
Cold atmospheric-pressure plasma (CAP) has demonstrated significant potential as a chemical-free sterilization technology because of its ability to inactivate bacteria and remove biofilms while remaining safe for temperature-sensitive materials. One method of generating CAP utilizes low-temperature co-fired ceramics (LTCC), a multilayer ceramic material capable of embedding conductive electrodes for plasma generation. However, the fabrication of LTCC plasma devices presents a recurring challenge. Current manufacturing methods rely on stacking multiple ceramic layers and electrically connecting the internal electrodes to an external copper rod using conductive silver paint. If these interconnections are incomplete or fail to establish electrical continuity throughout the device, plasma cannot be generated, resulting in failed parts, increased fabrication time, and unnecessary waste of materials and resources. To address this limitation, this research investigates the implementation of silver-filled vias to create reliable electrical pathways between conductive layers within the LTCC structure. The vias are formed by introducing small holes through the ceramic layers and filling them with conductive silver paste before firing, producing permanent vertical electrical interconnections throughout the device. It is hypothesized that incorporating silver-filled vias will improve electrical conductivity, create a more uniform current distribution, increase plasma generation efficiency, and improve overall device reliability while reducing manufacturing failures associated with conventional external interconnections. Device performance will be evaluated through comparing the amount of trials it takes for the device to generate with the prior design, and our current one. The implementation of silver-filled vias has the potential to improve both the manufacturing process and operational performance of LTCC plasma devices for future sterilization and decontamination applications.
Improving Electrical Connection through Silver Pasted Vias
Cold atmospheric-pressure plasma (CAP) has demonstrated significant potential as a chemical-free sterilization technology because of its ability to inactivate bacteria and remove biofilms while remaining safe for temperature-sensitive materials. One method of generating CAP utilizes low-temperature co-fired ceramics (LTCC), a multilayer ceramic material capable of embedding conductive electrodes for plasma generation. However, the fabrication of LTCC plasma devices presents a recurring challenge. Current manufacturing methods rely on stacking multiple ceramic layers and electrically connecting the internal electrodes to an external copper rod using conductive silver paint. If these interconnections are incomplete or fail to establish electrical continuity throughout the device, plasma cannot be generated, resulting in failed parts, increased fabrication time, and unnecessary waste of materials and resources. To address this limitation, this research investigates the implementation of silver-filled vias to create reliable electrical pathways between conductive layers within the LTCC structure. The vias are formed by introducing small holes through the ceramic layers and filling them with conductive silver paste before firing, producing permanent vertical electrical interconnections throughout the device. It is hypothesized that incorporating silver-filled vias will improve electrical conductivity, create a more uniform current distribution, increase plasma generation efficiency, and improve overall device reliability while reducing manufacturing failures associated with conventional external interconnections. Device performance will be evaluated through comparing the amount of trials it takes for the device to generate with the prior design, and our current one. The implementation of silver-filled vias has the potential to improve both the manufacturing process and operational performance of LTCC plasma devices for future sterilization and decontamination applications.