Direct-Write UV Photolithography: Fabrication Frameworks for Thin-Film Transistors and Laser Induced Graphene
Faculty Mentor Information
Dr. Dave Estrada, Boise State University
Presentation Date
7-15-2026
Abstract
This project investigates ultraviolet (UV) laser-material interactions using a commercially available 355 nm UV laser to develop scalable, low-cost fabrication methods for both thin-film transistors (TFTs) and laser-induced graphene (LIG) devices. Laser processing parameters, including power, scan speed, pulse frequency, and exposure strategy, are systematically optimized to fabricate high-resolution TFT structures through maskless direct-write photolithography while also producing ultrathin LIG for flexible electronic and wearable sensing applications. Fabricated features are characterized by evaluating linewidth, feature fidelity, process repeatability, and laser-material interactions, establishing process limits and guiding optimization for both fabrication approaches. By combining direct-write UV lithography with laser-induced material modification, this research demonstrates the potential of commercially accessible UV laser systems as versatile platforms for semiconductor process development, thin-film electronics, flexible sensors, and rapid prototyping of next-generation microscale devices.
Direct-Write UV Photolithography: Fabrication Frameworks for Thin-Film Transistors and Laser Induced Graphene
This project investigates ultraviolet (UV) laser-material interactions using a commercially available 355 nm UV laser to develop scalable, low-cost fabrication methods for both thin-film transistors (TFTs) and laser-induced graphene (LIG) devices. Laser processing parameters, including power, scan speed, pulse frequency, and exposure strategy, are systematically optimized to fabricate high-resolution TFT structures through maskless direct-write photolithography while also producing ultrathin LIG for flexible electronic and wearable sensing applications. Fabricated features are characterized by evaluating linewidth, feature fidelity, process repeatability, and laser-material interactions, establishing process limits and guiding optimization for both fabrication approaches. By combining direct-write UV lithography with laser-induced material modification, this research demonstrates the potential of commercially accessible UV laser systems as versatile platforms for semiconductor process development, thin-film electronics, flexible sensors, and rapid prototyping of next-generation microscale devices.