Fabrication of Lateral Field Emitter Jig and Electron Hop Funnel

Faculty Mentor Information

Dr. Jim Browning, Boise State University

Presentation Date

7-2025

Abstract

The Boise State CMEMs (Ceramic Micro Electrical Mechanical Systems lab) integrates field emitter arrays (FEAs) into vacuum electron devices. This is done using insulating funnels called electron hop funnels. Electrons are emitted into the wide end of the funnel, and utilizing secondary electron emission to sustain current, the electrons "hop" up the funnel walls. Eventually the electrons exit the funnel as a denser and more uniform electron beam. This poster shows the fabrication process of a field emitter array jig as well as the installation of a lateral field emitter wafer with jumped connections accompanying the electron hop funnel using low temperature co-fired ceramic (LTCC).

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Fabrication of Lateral Field Emitter Jig and Electron Hop Funnel

The Boise State CMEMs (Ceramic Micro Electrical Mechanical Systems lab) integrates field emitter arrays (FEAs) into vacuum electron devices. This is done using insulating funnels called electron hop funnels. Electrons are emitted into the wide end of the funnel, and utilizing secondary electron emission to sustain current, the electrons "hop" up the funnel walls. Eventually the electrons exit the funnel as a denser and more uniform electron beam. This poster shows the fabrication process of a field emitter array jig as well as the installation of a lateral field emitter wafer with jumped connections accompanying the electron hop funnel using low temperature co-fired ceramic (LTCC).